DISCO Corporation
A precision-processing specialist combining dicing, grinding and polishing equipment with the blades, wheels and process knowledge used by those systems.
Company Snapshot
- Founded
- 1937
- Headquarters
- 13-11 Omori-kita 2-chome, Ota-ku, Tokyo 143-8580, Japan
- Capital
- ¥22.382 billion
- Latest net sales
- ¥436.9 billionFY ended March 2026, consolidated
- Primary focus
- Cutting, grinding and polishing
- Value-chain position
- Wafer and package processing
Head Office
13-11 Omori-kita 2-chome, Ota-ku, Tokyo 143-8580, Japan
Manufacturing Sites
- Hiroshima — Kure City (Kure Plant)
- Hiroshima — Kure City (Kuwabata Plant)
- Nagano — Chino City (Chino Plant)
Company Overview
DISCO develops precision equipment and tools for cutting, grinding and polishing semiconductor wafers and other hard materials. Its portfolio includes dicing and laser saws, grinders, polishers, mounters, inspection systems and consumable blades and wheels.
DISCO’s competitive model combines capital equipment with process know-how and recurring precision tools. That combination matters because wafer thinning and singulation must balance throughput, kerf width, surface quality, breakage and device yield across increasingly valuable wafers and packages.
Technology & Products
Dicing saws
Blade-based separation of wafers and packaged devices.
Laser saws
Laser processing for materials and structures requiring alternative separation methods.
Wafer grinders
Back grinding and thinning of semiconductor wafers.
Polishers
Surface finishing and stress-removal processes.
Precision blades and wheels
Consumables matched to equipment and customer processes.
Process support
Applications testing, training, maintenance and recycling services.
Position in the Supply Chain
DISCO operates between wafer fabrication and packaging, where wafers are thinned, divided and prepared for assembly. Its tools are also relevant to compound semiconductors, electronic components and other difficult materials requiring precise mechanical or laser processing.
Strategic Position
Its differentiation rests on the interaction among equipment, consumables and customer process data. Consumables can provide recurring demand, while close applications support helps the company respond to new wafer materials, package formats and thickness requirements.
Ecosystem Impact
DISCO’s activities connect abrasive materials, precision spindles, motion systems, water management, laser sources, inspection and factory automation. Advanced packaging and power semiconductors broaden the set of materials and processes requiring optimized separation.
Outlook
Growth Drivers
- Thinner wafers and advanced packaging
- More difficult materials including SiC
- Higher device value and damage-control requirements
- Recurring demand for precision consumables
Risks
- Semiconductor production and equipment cycles
- Alternative separation and processing technologies
- Customer qualification for new materials
- Capacity, service and supply-chain execution
Key Points to Watch
- Equipment versus consumables growth
- Advanced-packaging applications
- SiC and compound-semiconductor demand
- New process adoption and service expansion
Official Sources
Editorial note: This independent profile is based primarily on company-published information. Business conditions, products and plans may change. SemiStructure is not affiliated with the company, and this page does not constitute investment advice.
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